JPS6457646U - - Google Patents
Info
- Publication number
- JPS6457646U JPS6457646U JP15082887U JP15082887U JPS6457646U JP S6457646 U JPS6457646 U JP S6457646U JP 15082887 U JP15082887 U JP 15082887U JP 15082887 U JP15082887 U JP 15082887U JP S6457646 U JPS6457646 U JP S6457646U
- Authority
- JP
- Japan
- Prior art keywords
- barcode label
- barcode
- frame
- affixing area
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims description 2
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15082887U JPS6457646U (en]) | 1987-10-01 | 1987-10-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15082887U JPS6457646U (en]) | 1987-10-01 | 1987-10-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457646U true JPS6457646U (en]) | 1989-04-10 |
Family
ID=31424318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15082887U Pending JPS6457646U (en]) | 1987-10-01 | 1987-10-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457646U (en]) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60100450A (ja) * | 1983-11-07 | 1985-06-04 | Disco Abrasive Sys Ltd | 半導体ウエーハ装着及び切断装置 |
| JPS6025058B2 (ja) * | 1981-05-26 | 1985-06-15 | 信越化学工業株式会社 | シリコ−ンゴム組成物 |
-
1987
- 1987-10-01 JP JP15082887U patent/JPS6457646U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6025058B2 (ja) * | 1981-05-26 | 1985-06-15 | 信越化学工業株式会社 | シリコ−ンゴム組成物 |
| JPS60100450A (ja) * | 1983-11-07 | 1985-06-04 | Disco Abrasive Sys Ltd | 半導体ウエーハ装着及び切断装置 |